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FEA                  Finite Element Analysis. The nonlinear problem which has to solved is divided into a mesh with linear areas. This small                  areas are calculated. This method has the advantage that every geometrY can be analysed: Multilayer                  A printed board with more than two copper layer is called multilayer. Multilayer consists of several laminats with copper on                  top and bottom. This lamiantes are isolated to each other by prepregs. By high pressure and heat a compact PCB                  is created. Planar Transformer                  Planar transformer are low components with good high frequency behavior                  and therefore with high power densities. Planar transformer can be used for                  flyback or forward converters. Typical hights are between 6 and 20 mm.                  The power capability reach from 5W up to 5kW and more.                  There are two different technologies for creating windings:                  The stacking technology use thick copper lead frames which are isolated by                  plastic foils. If necessary additional bobbins are used to realized creepage                  distances.                  The second method is to realize windings by a multilayer. The windings are                 are etched in copper. This technology guarantees a high process capability                  and can even be used for high voltage application. Planar Inductor                 Also like planar transformers chokes can be created in a flat construction.                 But the slope of the current must not be to high. VHDL                 Most used language to describe complex digital logic. There are the Behavioral                 Level und the RTL Level decription. Apart from a special form of Behavioral                 discription only RTL can be synthzised to gate netlist.